About the role
Packaging Technology Integration, Staff Engineer role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
FablessOnsiteHardware Engineering
Key Responsibilities
- Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets.
- Be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management, Product Marketing, Quality, Reliability, Operations, Customer Engineering, Supplier Quality, and internal and external manufacturing partners.
- This position requires a senior technical specialist who owns end‑to‑end packaging technology and product integration, including wafer pre‑assembly (wafer BE), spanning technology development, chip‑to‑package co‑design, NPI, high volume manufacturing (HVM) interaction, and customer lifecycle support, to deliver robust and scalable solutions.
- Operate as a senior technical lead in a global, cross‑functional matrix, driving technology readiness, execution, and product timelines.
- Drive development and integration of Si and GaAs packaging processes from wafer‑level interconnect and RDL through Cu pillar bumping, singulation, and flip‑chip assembly.
- Lead and qualify wafer singulation technologies, including stealth dicing and plasma dicing, with ownership of die strength, edge quality, yield, and reliability tradeoffs.
Requirements
- Master's degree in mechanical, Materials, Chemical, or Electrical Engineering
- PhD preferred. 10+ years' experience in semiconductor packaging, preferably RF modules / SiP. Demonstrated ownership across technology development, NPI, HVM, and customer support. Hands‑on experience in wafer pre‑assembly / wafer BE, including Cu pillar or micro‑bump bumping, wafer singulation (stealth dicing, plasma dicing), and die sort. Demonstrated ability to debug and resolve wafer‑level yield, die integrity, and reliability issues impacting downstream assembly and HVM. Strong understanding of packaging materials, process interactions, failure mechanisms, and reliability. Hands‑on experience with tier‑1 foundries and OSATs. Working knowledge of industry standards (IPC, JEDEC, IEEE, ISO, ANSI). Experience in qualification, reliability testing, and failure analysis. Solid foundation in statistics, SPC, and FMEA. Strong cross‑functional communication and leadership skills. Willingness to travel internationally (~once per quarter). Bachelor's degree in engineering or related field and 6+ years of relevant experience
- Or Master's degree in engineering or related field and 5+ years of relevant experience
- Or PhD in Engineering or related field and 4+ years of relevant experience.
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers . Bachelor's degree in engineering or related field and 6+ years of relevant experience
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers .