About the role
Lead development and transfer of next‑generation lithography processes for micro‑acoustic filters and wafer‑level packaging, defining requirements, conducting DOE, and driving yield and reliability improvements.
FablessOnsiteHardware Engineering
Key Responsibilities
- Lead and co‑work with global process cluster on development of next‑generation lithography for microacoustics filter and wafer‑level packaging from concept to qualification and manufacturing release.
- Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
- Drive root‑cause
Requirements
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Technology Development
- Lead and/ or co-work with global process cluster on the development of next generation lithography for microacoustics filter and waferlevel packaging from concept to qualification and manufacturing release.
- Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
- Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
- Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp
- Work with project leader on technology transfer - from pilot line to high‑volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.