About the role
Proactive and technically skilled Process Engineer to support backend wafer‑level manufacturing operations, focusing on tape expansion, UV curing, and taping processes, troubleshooting equipment, process optimization, vendor management, continuous improvement, and cross‑functional project leadership.
FablessOnsiteHardware Engineering
Key Responsibilities
- Lead and sustain backend processes including Tape Expansion, UV Curing and Taping
- Perform hands‑on troubleshooting of process‑related issues
- Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs
- Drive permanent solutions to resolve chronic process and quality issues
- Lead investigation for process quality escalation
- Lead process buy‑off and performance validation for new machines and technologies
Requirements
- Bachelor's Degree in Mechanical, Manufacturing, or related Engineering discipline
- Minimum 2 years of hands‑on experience in semiconductor backend packaging specifically Tape Expansion, UV Cure, Taping, Reel‑to‑Reel processes