AMD
Mechanical and Thermal Analysis of Advanced Packaged Devices Intern
{'name': 'Student / Intern / Temp'}
Location
Singapore, Singapore
Department
{'name': 'Student / Intern / Temp'}
Posted
1mo ago
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Opens AMD's careers page · Last scraped 4 Jun 2026
Job Description
<br><strong class="jdheading"></strong><br><br><p style="margin: 0px;"><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;">As an AMD </span><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: red;">[intern/co-op]</span><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;">, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.</span></p><p style="margin: 0px;"><strong><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;"> </span></strong></p><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>LOCATION:</strong> Singapore</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>CRITERIA: </strong>Current students studying in Universities which are based in Singapore</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>INTERNSHIP DURATION:</strong> </span><span style="font-family: arial; font-size: 12pt;">The internship will begin on either 4 May 2026 or 20 July 2026, and will end on 4 Dec 2026. There is an option to extend the internship, with the extended period concluding on a fixed date of 18 Dec 2026.</span></div><div> </div><div style="text-align: center;"><span style="text-decoration: underline; font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>Intern- Mechanical and Thermal Analysis of Advanced Packaged Devices</strong></span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>WHAT YOU CAN EXPECT TO LEARN:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Exposure to cross-functional collaboration in a high-tech R&D environment.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Insights into the challenges and innovations in advanced packaging technologies.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Professional development through technical presentations and documentation.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>PROJECT OVERVIEW:</strong></span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">This internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions. The project supports the growth of the Advanced Packaging Lab in Singapore and aims to enhance understanding of package reliability and performance.</span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>KEY RESPONSIBILITIES:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Present findings to internal stakeholders and participate in technical discussions.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Continuously refine experimental procedures and maintain clear documentation.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>WHO ARE WE LOOKING FOR:</strong></span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">A self-driven individual that is resourceful, passionate about running experiments and</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">analysing data. Able to work independently, has a good work attitude and willing to learn.</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Should have good communication and presentation skills.</span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>RELEVANT SKILLSETS:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Familiarity with thermal and mechanical characterization techniques is a plus.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Excellent communication and presentation skills.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Ability to work independently and in a team-oriented environment.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>ACADEMIC CREDENTIALS:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Electrical Engineering, Materials Science, or Materials Engineering preferred.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">#LI-SP</span></div><h2>Responsibilities</h2><p style="margin: 0px;"><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;">As an AMD </span><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: red;">[intern/co-op]</span><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;">, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.</span></p><p style="margin: 0px;"><strong><span style="font-size: 12.0pt; font-family: 'Arial',sans-serif; color: black;"> </span></strong></p><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>LOCATION:</strong> Singapore</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>CRITERIA: </strong>Current students studying in Universities which are based in Singapore</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>INTERNSHIP DURATION:</strong> </span><span style="font-family: arial; font-size: 12pt;">The internship will begin on either 4 May 2026 or 20 July 2026, and will end on 4 Dec 2026. There is an option to extend the internship, with the extended period concluding on a fixed date of 18 Dec 2026.</span></div><div> </div><div style="text-align: center;"><span style="text-decoration: underline; font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>Intern- Mechanical and Thermal Analysis of Advanced Packaged Devices</strong></span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>WHAT YOU CAN EXPECT TO LEARN:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Exposure to cross-functional collaboration in a high-tech R&D environment.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Insights into the challenges and innovations in advanced packaging technologies.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Professional development through technical presentations and documentation.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>PROJECT OVERVIEW:</strong></span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">This internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions. The project supports the growth of the Advanced Packaging Lab in Singapore and aims to enhance understanding of package reliability and performance.</span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>KEY RESPONSIBILITIES:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Present findings to internal stakeholders and participate in technical discussions.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Continuously refine experimental procedures and maintain clear documentation.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>WHO ARE WE LOOKING FOR:</strong></span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">A self-driven individual that is resourceful, passionate about running experiments and</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">analysing data. Able to work independently, has a good work attitude and willing to learn.</span></div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Should have good communication and presentation skills.</span></div><div> </div><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>RELEVANT SKILLSETS:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Familiarity with thermal and mechanical characterization techniques is a plus.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Excellent communication and presentation skills.</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Ability to work independently and in a team-oriented environment.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;"><strong>ACADEMIC CREDENTIALS:</strong></span></div><ul><li><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">Electrical Engineering, Materials Science, or Materials Engineering preferred.</span></li></ul><div><span style="font-family: arial, helvetica, sans-serif; font-size: 12pt; color: #000000;">#LI-SP</span></div>